Job description

Develop advanced packaging techniques and processes for the assembly of high density and high performance electronic devices
Closely working with external customers for technical support and process development
Closely working with internal R&D and product teams to develop new processes and products

Job requirements

MPhil. or PhD. in Material Science, Physics, Engineering or related disciplines
Hand-on experience in various semiconductor assembly equipment is preferred
Well-trained by DOE tool to construct and conduct Design of experiment (DOE) for various assembly process optimization
Familiar with the analytical equipment for failure mode analysis such as SEM/EDX, C-SAM, AFM, confocal microscope, surface profiler, high power optical microscope,
Experience in semiconductor Front-end/ Back-end process development is preferred
Experience of using ANSYS or ABACUS to build model for stress and thermal simulation is a plus
Optimistic and positive attitude
Good communication skill
Work independently and also a good team player

Attractive salary and fringe benefits package will be offered to the right candidates.

Interested parties please submit your application with cover letter, resume, certificate and transcripts.

Data collected will be used for recruitment purpose only. Suitable candidates may be referred to other vacancies within our company.

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